(China (Mainland))
Product Summary
The TLP181G is a small outline coupler, suitable for surface mount assembly. It consists of a photo transistor optically coupled to a gallium arsenide infrared emitting diode in a four lead plastic DIP package.
Parametrics
TLP181G absolute maximum ratings: (1)Forward current IF: 50mA; (2)Forward current detating △IF/℃: -0.7mA/℃(Ta≥53℃); (3)Pulse forward current IFP: 1A(100μs pulse, 100pps); (4)Reverse voltage VR: 5V; (5)Junction temperature Ti: 125℃; (6)Storage temperature range Tstg: -55 to 125℃; (7)Operating temperature range Topr: -55 to 100℃; (8)Lead soldering temperature Tsol: 260(10s)℃; (9)Total package power dissipation PT: 200mW; (10)Total package power dissipation derating(Ta≥25℃) △PT/℃: -2.0mW/℃; (11)Isolation voltage BVS: 3750Vrms(AC, 1min, RH≤60%).
Features
TLP181G features: (1)Collector-emitter voltage: 80V(min); (2)Current transfer ratio: 50%(min); rank GB: 100%(min); (3)Isolation voltage: 3750Vrms(min); (4)UL recognized: UL1577, File No.E67349.
Diagrams
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 TLP181GB |
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